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View Generic Document: Thermal Deterioration of HFPE-II-52 Polymeride

Citation: Green, Adam (2007). Thermal Deterioration of HFPE-II-52 Polymeride. Cornell Center for Materials Research.
Collection: Cornell Center for Materials Research REU Program  
 
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Title Thermal Deterioration of HFPE-II-52 Polymeride
Author(s) Green, Adam
Keyword(s) HFPE-II-52
polymeride
high temperature
steam pressure
blistering
thermal deterioration
Abstract/Summary The polymeride HFPE-II-52 has proposed uses as a structural component in situations where high temperatures will be encountered. Due to the polymeride being made from a powered material voids exist in the polymeride after it was been manufactured. These voids can fill with water when placed under high humidity conditions. When the voids have filled with water and the specimen is exposed to high temperature blisters for within the sample. These can blisters cause damage that could compromise the structure in which they form. When the polymeride is used to form a graphite composite sheet the blister will split apart the sheets it is between. The sheets over the blister will delaminate furthering the damage to the structure. The polymeride's physical properties are changes by conditions formed with a temperature at or above 100 degrees Celsius and when steam is present and is at its saturation pressure. The changes in the physical properties are characterized as a decrease in the glass transition temperature as the temperature is increased. At 215 degrees with steam at its saturation pressure the glass transition temperature drops enough so that the polymeride enters its glass transition temperature. When compared to the glass transition temperature of 350-370 with no steam pressure applied deterioration of the polymeride under steam pressure become a concern.
Publisher Cornell Center for Materials Research
Date 2007-08-29
Copyright Notice Copyright 2007 CCMR. Materials from the CCMR website may not be used without permission.
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Additional Notes Support for the CCMR is provided through the NSF Grant DMR 0520404, part of the NSF MRSEC Program. Additional support is provided by Cornell University, the State of New York, and by industrial sources.
 
 
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Created: Fri, 18 Jan 2008, 06:36:11 EST by Cathy Lowe. Detailed History


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